Helio X23 and Helio X27 has been announced by MediaTek. The X20 chipset successors receive gains in many departments while MediaTek claims that both SoCs are designed for heavy-duty, high-end devices.

MediaTek Helio X23 and X27 Benchmarks are Compatible for Premium Device

Both SoCs support 2X LPDDR3 POP 800MHz memory. The chipsets are compatible for 2560 x 1600 pixel resolutions WQVGA display.

X23 and X27 are tri-cluster, deca-core architectures with 20nm process. MediaTek Executive Vice President Jeffrey Ju claimed that both are the best in the category as they support premium device specifications, Fox34 reported.

The chips feature MiraVision EnergySmart for screen-power saving mode and a tracker module called Envelope Tracking Module that will improve the smartphone's battery efficiency of up to 25 percent, GSM Arena reported.

For optics department, the SoCs support dual-lens camera module with Imagiq ISP technology. It allows a device to integrate mono and color at once and the Depth of Field ability after processing the image using 3D in-built engine.

MediaTek Helio X23 and X27 keep up with today's demand

The Chinese semiconductor company is pretty much adapted to the latest trend in smartphone industry. A dual-lens camera seems to be a necessity, and with both SoCs support such module, the chipsets enable the optics to capture images in excellent clarity with wide variety of apps to optimize shooting.

As for the Envelop Tracking Module, the technology lets a device to adjust the output voltage based on signal strength and smartly reduce the power up to 15 percent when necessary.

The MiraVision automatically adjusts lighting condition according to the on-screen content, allowing users to get the best visual experience.

MediaTek Helio X23 and X27 will be on board in 2017

Tech crowds can expect the 2017 smartphones, specifically the affordable ones, to rock X23 or X27 chipset.

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